Printed-Circuit Board Assembly Capabilities:
- Automated Through Hole Technology (THT)
- Automated Surface Mount Technology (SMT)
- Ball Grid Array (BGA)
- Hybrid Boards
- Testing
- MDA, AOI, X-RAY Inspection
- Additional Bench Testing and Troubleshooting Capability
- Functional Testing to Customer Specifications
- Design For Manufacturability (DFM)
- Design For Testability (DFT)
- Prototyping
- Full Turnkey or Consignment
- Repair and Upgrade
- Quick Turns (in less than one week)
- Standard lead times 2-4 weeks
- Just in Time (JIT)
- Fine-Pitch and BGA Devices
- Printed Circuit Board Quality
- IPC Standards: 610 rev. C, class I, II, III
- ISO 9002 in Q2 of 2001
- ESD Compliant Environment
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